This webinar focuses on the challenging task of measuring epoxy mold compound (EMC) thickness distribution across the wafer. An optical sensor based on spectral coherence interferometry (SCI) can be utilized to collect critical measurements related to mold thickness, uniformity and height information between bumps and the mold surface. This is particularly demanding due to the high inhomogeneity and variation of the surface structure which makes it particularly difficult to analyze. The mold material creates many challenges for the process control loop due to its low reflectivity and strong internal scattering. Conventional optical thickness metrology methods fail to deliver data.
This webinar is a great opportunity to learn about SCI – an optical, non-destructive, high-throughput solution to measure mold thickness and surface warpage simultaneously. This is done by utilizing a sensor with high numerical aperture (NA) which enables one to measure layers and surfaces of mold materials despite the usual measurement constraints. By adding a bottom sensor in twin-configuration, further simultaneous data collection is possible. The bottom sensor works in conjunction with the top sensor to measure total silicon (or glass) wafer thickness, as well as total thickness variation (TTV) in order to determine the redistribution layer (RDL) thickness.
Participants Will Learn:
- Spectral Coherence Interference Technology
- Different approaches and measurement designs to measure mold thickness
- Advanced Packaging examples
Who Should Attend:
- Application Engineers
- Researchers/ R&D Managers
- Laboratory Supervisors
- Laboratory Technicians / Operators
Originally recorded August 2017
Duration: 45 minutes
Presented by Quantum Analytics
Julia Brueckner, PhD
Application Scientist, Quantum Analytics
Julia Brueckner received her PhD in Physical Chemistry at the University of Heidelberg, Germany. She worked for Sentronics Metrology, a Germany-based metrology equipment supplier before she was transferred to the US distributor Quantum Analytics. Here she works as applications engineer promoting optical metrology solutions and providing technical support to customers.