Recorded: July 28, 2016
It is well known that cleanroom and lab real-estate are valuable commodities. The desire for space efficiency in these environments makes multi-function, configurable metrology systems a preferable solution.
This webinar will address the challenge of how to measure wafer thickness in the micrometer range, while simultaneously gaining surface bow/warpage information. We’ll show you the optical technology – that is, decoding the interferometrically encoded depth information in a spectrally resolved manner. Plus, we’ll show you how real-time analysis of the data is applied. Combining the configurable process control benefits of a multi-sensor tool with a very fast acquisition time (up to 4,000 samples per second) enables the high-speed generation of full wafer maps. The end result – a high wafer throughput solution that is easy on your capital budget and your operational resources.
Watch this on-demand webinar to learn how Sentronics Metrology systems enable the measurement of multiple process control parameters with one powerful, multi-sensor platform.
About Sentronics Metrology GmbH
Ph.D, Quantum Anaytics
Julia, a native of Offenbach, Germany, received her Bachelor and Master of Science degrees from Johann-Wolfgang-Goethe University, Frankfurt. In 2015, she received her Ph.D. in Chemistry from the University of Heidelberg for her dissertation: Ultrafast Triplet Formation in N-Substituted Pentacene Derivatives. During her studies she was awarded several scholarships including a Fulbright scholarship to UC Berkley, and a Procter & Gamble award for the best thesis in the Master of Chemistry studies. Upon receiving her Ph.D., Julia joined Sentronics Metrology in Mannheim, Germany as an applications engineer.